Notes:
1. Materials
a. Housing: LCP+30% GF,UL94 V-0(E471i or Equivalent);
b. Contact: C5210-SH (T=0.12mm),Gold Plating at mating area(See P/N),
100u" Min. Matte Tin plating at solder tail, all over Nickel(50u" Min.);
c. Leg: C2680-EH T0.20mm, 100u" Min. Matte Tin plating, all over nickel(50u" Min.).
2. RoHS 2.0 and HF compliant;
3. Ratings
a. Voltage Rating: 50V AC (Per pin);
b. Current Rating: 0.5A (Per pin);
c. Operating Temperature: -40°C ~ 80°C;
4. Electrical Requirement:
a. LLCR: 55mΩ Max,(Initial), 20mΩ Max. change allowed(Final);
b. Dielectric Withstanding Voltage: 300V AC (RMS) for 1 minute;
c. Insulation Resistance: 500MΩ Min. @ 500V DC;
5. Mechanical Requirement:
a. Mating Force: 20N Max.;
b. Unmating Force: 20N Max.;
c. Durability: 60 Cycles;
d. Vibration: No electrical discontinuity greater than 1u sec shall occur;
e. Mechanical Shock: 285G half sine / 6 axis,
No electrical discontinuity greater than 1u sec shall occur;
6. Resistance to heat: the temperature shall be 260±5°C 10±1 seconds.